| Advanced Interconnections Corporation has recently become the world's leading manufacturer of IC Sockets and Adapters for Ball Grid Array (BGA) package devices. Advanced's patented eutectic solder ball terminals have earned recognition as the industry's most preferred solution for proven long-term performance in vigorous temperature cycling applications. In addition to our BGA Socketing Systems, Advanced designs and manufactures a wide variety of sockets and adapters for semiconductors in PGA, DIP and SIP packages as well as an extensive line of board to board connectors and adapters for test, production, emulation, and package conversion applications.
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